Surface Mounting Technology

Explore Our Advanced SMT Equipment Line

State-of-the-Art EMS & SMT Assembly Facility

We have established a world-class, state-of-the-art manufacturing facility in Kotdwara, Uttarakhand, reflecting our unwavering commitment to technological excellence and innovation. Spanning over 100,000 sq. ft. of fully air-conditioned, modern infrastructure, the facility is designed to optimize efficiency, quality, and operational control across all functions. Manufacturing under one roof—creating a powerful synergy that drives high performance and accelerates delivery of next-generation solutions. We invite you to learn more about our company or explore our specialized fiber optic cable manufacturing lines.

Our electronics manufacturing division is equipped with:

SOLDER PASTE PRINTER (GKG G-STAR)

  • Advanced Solder Paste Printing Machine
  • Employs automatic PCB thickness adjustment
  • Automatic stencil cleaning
  • Core cycle time of under 8.5 seconds (excluding printing)
  • Delivers highly repeatable printing accuracy (±0.025 mm)

3D SOLDER PASTE INSPECTION (KOH YOUNG KY-8030-3)

  • Advanced 3D SPI Machine
  • Eliminates shadows via dual-projection technology
  • Delivers quantitative volume measurements with 100% inspection coverage
  • Optimized for high-speed inspection (up to 30.6 cm²/sec)
  • Accurately inspects features down to 100 µm spacing
3D SOLDER PASTE INSPECTION (KOH YOUNG KY-8030-3)

HIGH SPEED CHIP MOUNTER (PANASONIC AM100 / NPM-D3)

  • Ultra-Precise Component Placement
  • Equipped with 10 Panasonic high-speed pick-and-place machines
  • Combined placement capacity of 400,000 components per hour (CPH)
  • Ensures highly reliable component handling
  • Guarantees 100% placement accuracy across complex assemblies
HIGH SPEED CHIP MOUNTER (PANASONIC AM100 / NPM-D3)

HOT AIR REFLOW OVEN (HELLER 1809 MK5)

  • High-Performance Reflow Soldering
  • Features 9 top and bottom heating zones with 2 cooling zones
  • Equipped with a high-capacity, lead-free certified process chamber
  • Employs advanced nitrogen atmosphere control to minimize oxidation
  • Provides ultra-stable temperature profiles across all zones
HOT AIR REFLOW OVEN (HELLER 1809 MK5)

3D AUTOMATIC OPTICAL INSPECTION (KOH YOUNG ZENITH LITE)

  • Advanced 3D AOI System
  • Measures component heights, tilt, and solder fillets quantitatively
  • Performs full-inspect 3D component profiling
  • Dramatically reduces false calls via smart software filters
  • Features auto-programming capability to expedite job changes
3D AUTOMATIC OPTICAL INSPECTION (KOH YOUNG ZENITH LITE)

X-RAY INSPECTION (X-EYE 5000N)

  • High-Resolution X-Ray Inspection
  • Equipped with a 100kV micro-focus closed tube
  • Delivers magnification up to 240x for critical inspection
  • Performs non-destructive validation of BGA voiding and hidden solder joints
  • Features programmable multi-axis inspection capability
X-RAY INSPECTION (X-EYE 5000N)

AUTOMATIC PCB CLEANING & STORAGE

  • Automatic PCB Loader/Unloader systems
  • Ensures ESD-safe board handling throughout the line
  • Maintains clean storage environments between manufacturing steps
  • Prevents board contamination and physical damage
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